SI3050-E1-FMR
vs
SI3050-E1-FM
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
QFN-24
|
QFN-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Silicon Labs
|
Silicon Labs
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
S-XQCC-N24
|
S-XQCC-N24
|
| Length |
4 mm
|
4 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HQCCN
|
HQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
4 mm
|
4 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare SI3050-E1-FMR with alternatives
Compare SI3050-E1-FM with alternatives