SI2306BDS-T1-E3
vs
2V7002LT1G
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Not Recommended
|
Active
|
Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
ONSEMI
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
17 Weeks, 3 Days
|
22 Weeks, 4 Days
|
Samacsys Manufacturer |
Vishay
|
onsemi
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOT-23 (TO-236) 3 LEAD
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
318-08
|
Configuration |
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
|
60 V
|
Drain Current-Max (ID) |
|
0.115 A
|
Drain-source On Resistance-Max |
|
7.5 Ω
|
FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
Feedback Cap-Max (Crss) |
|
5 pF
|
JEDEC-95 Code |
|
TO-236
|
JESD-30 Code |
|
R-PDSO-G3
|
Number of Elements |
|
1
|
Number of Terminals |
|
3
|
Operating Mode |
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Polarity/Channel Type |
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
|
0.3 W
|
Reference Standard |
|
AEC-Q101
|
Surface Mount |
|
YES
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
|
|
|
Compare SI2306BDS-T1-E3 with alternatives
Compare 2V7002LT1G with alternatives