SG73S2ELTDD302J
vs
MCR25JZHJ302
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
KOA SPEER ELECTRONICS INC
|
ROHM CO LTD
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e0
|
e3
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.6 mm
|
0.55 mm
|
| Package Length |
3.2 mm
|
3.2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.6 mm
|
2.5 mm
|
| Packing Method |
TR, Paper, 10 Inch
|
TR, EMBOSSED, 7 INCH
|
| Rated Power Dissipation (P) |
0.5 W
|
0.5 W
|
| Resistance |
3000 Ω
|
3000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1210
|
1210
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
Tin (Sn) - with Nickel (Ni) barrier
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Samacsys Manufacturer |
|
ROHM Semiconductor
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Reference Standard |
|
AEC-Q200; IATF 16949
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare SG73S2ELTDD302J with alternatives
Compare MCR25JZHJ302 with alternatives