SG73P2ETTDD330J
vs
SG73P2ELTED330J
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
KOA SPEER ELECTRONICS INC
Package Description
CHIP
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8533.21.00.30
Construction
Rectangular
Chip
JESD-609 Code
e3
e0
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
3.2 mm
3.2 mm
Package Style
SMT
SMT
Package Width
2.6 mm
2.6 mm
Packing Method
TR, PAPER, 10 INCH
TR, Punched Paper, 10 Inch
Rated Power Dissipation (P)
0.5 W
0.5 W
Rated Temperature
70 °C
Reference Standard
AEC-Q200
Resistance
33 Ω
33 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1210
1210
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
MATTE TIN OVER NICKEL
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Compare SG73P2ETTDD330J with alternatives
Compare SG73P2ELTED330J with alternatives