SG73P2BLTE114J
vs
RK73B2BTTEB114J
feature comparison
All Stats
Differences Only
Pbfree Code
No
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
KOA SPEER ELECTRONICS INC
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Construction
Chip
Chip
JESD-609 Code
e0
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
3.2 mm
3.2 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
TR, PUNCHED PLASTIC, 7 INCH
TR, EMBOSSED PLASTIC, 13 INCH
Rated Power Dissipation (P)
0.33 W
0.25 W
Rated Temperature
70 °C
70 °C
Resistance
110000 Ω
110000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
MATTE TIN OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Reference Standard
AEC-Q200
Compare SG73P2BLTE114J with alternatives
Compare RK73B2BTTEB114J with alternatives