SG73P2BLTDD470J vs SG73P2BLTE470J feature comparison

SG73P2BLTDD470J KOA Speer Electronics Inc

Buy Now Datasheet

SG73P2BLTE470J KOA Speer Electronics Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer KOA SPEER ELECTRONICS INC KOA SPEER ELECTRONICS INC
Reach Compliance Code not_compliant not_compliant
Construction Chip Chip
JESD-609 Code e0 e0
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.6 mm
Package Length 3.2 mm 3.2 mm
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, Paper, 10 Inch TR, PUNCHED PLASTIC, 7 INCH
Rated Power Dissipation (P) 0.33 W 0.33 W
Resistance 47 Ω 47 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Pbfree Code No
Package Description CHIP
ECCN Code EAR99
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

Compare SG73P2BLTDD470J with alternatives

Compare SG73P2BLTE470J with alternatives