SG3845DM
vs
KA3842BDT&R
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
SOP, SOP8,.25
|
SOP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
25 V
|
30 V
|
| Input Voltage-Min |
8.2 V
|
11.5 V
|
| Input Voltage-Nom |
15 V
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
|
| Length |
4.915 mm
|
10 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.95 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
SINGLE
|
SINGLE
|
| Switching Frequency-Max |
500 kHz
|
500 kHz
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.875 mm
|
4.5 mm
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Output Voltage-Nom |
|
2.5 V
|
| Supply Current-Max (Isup) |
|
17 mA
|
|
|
|
Compare SG3845DM with alternatives
Compare KA3842BDT&R with alternatives