SG3845DM vs SG1845J/883 feature comparison

SG3845DM Microsemi Corporation

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SG1845J/883 Microsemi Corporation

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Pbfree Code Yes No
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code SOIC DIP
Package Description SOP, SOP8,.25 DIP, DIP14,.3
Pin Count 8 14
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SWITCHING CONTROLLER SWITCHING CONTROLLER
Control Mode CURRENT-MODE CURRENT-MODE
Control Technique PULSE WIDTH MODULATION PULSE WIDTH MODULATION
Input Voltage-Max 25 V 25 V
Input Voltage-Min 8.2 V 8.3 V
Input Voltage-Nom 15 V 15 V
JESD-30 Code R-PDSO-G8 R-GDIP-T14
JESD-609 Code e3 e0
Length 4.915 mm 19.62 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Current-Max 1 A 1 A
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP8,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Surface Mount YES NO
Switcher Configuration SINGLE SINGLE
Switching Frequency-Max 500 kHz 500 kHz
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3.875 mm 7.62 mm
Base Number Matches 3 4
Screening Level MIL-STD-883 Class B

Compare SG3845DM with alternatives

Compare SG1845J/883 with alternatives