SG3525AN#PBF
vs
SG2525AJ
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| JESD-30 Code |
R-PDIP-T16
|
R-XDIP-T16
|
| JESD-609 Code |
e3
|
e0
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Output Current-Max |
0.1 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Switching Frequency-Max |
400 kHz
|
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
8
|
|
|
|
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