SG2524BDW-TR
vs
SG2524CF
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
SOP, SOP16,.4
|
DIP, DIP16,.3
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
|
| Control Mode |
CURRENT-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
|
| Input Voltage-Max |
40 V
|
|
| Input Voltage-Min |
7 V
|
|
| Input Voltage-Nom |
20 V
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-XDIP-T16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.9 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Output Current-Max |
0.2 A
|
0.2 A
|
| Output Voltage-Max |
5.05 V
|
|
| Output Voltage-Min |
4.95 V
|
|
| Output Voltage-Nom |
5 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.4
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
1.75 mm
|
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
PUSH-PULL
|
|
| Switching Frequency-Max |
600 kHz
|
400 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
6 mm
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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