SG2118Y
vs
SG1118AY
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LINFINITY MICROELECTRONICS
|
LINFINITY MICROELECTRONICS
|
Package Description |
DIP, DIP8,.3
|
DIP, DIP8,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Bias Current-Max (IIB) @25C |
0.002 µA
|
0.002 µA
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
3000 µV
|
1000 µV
|
JESD-30 Code |
R-XDIP-T8
|
R-XDIP-T8
|
JESD-609 Code |
e0
|
e0
|
Low-Offset |
NO
|
NO
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-25 °C
|
-55 °C
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Slew Rate-Min |
0.1 V/us
|
0.1 V/us
|
Supply Voltage Limit-Max |
20 V
|
20 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
OTHER
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
300
|
300
|
Voltage Gain-Min |
25000
|
40000
|
Base Number Matches |
1
|
3
|
|
|
|
Compare SG2118Y with alternatives
Compare SG1118AY with alternatives