SG1845J/883B vs MIC38C42BM feature comparison

SG1845J/883B Microsemi Corporation

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MIC38C42BM Microchip Technology Inc

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Pbfree Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SILICON GENERAL INC MICREL INC
Part Package Code DIP SOIC
Package Description , SOP, SOP8,.25
Pin Count 14 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SWITCHING CONTROLLER SWITCHING CONTROLLER
Control Mode CURRENT-MODE CURRENT-MODE
Control Technique PULSE WIDTH MODULATION PULSE WIDTH MODULATION
Input Voltage-Max 30 V 30 V
Input Voltage-Min 8.2 V 10 V
JESD-30 Code R-GDIP-T14 R-PDSO-G8
Number of Functions 1 1
Number of Terminals 14 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Current-Max 1 A 0.5 A
Output Voltage-Nom 2.5 V
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max (Isup) 17 mA
Surface Mount NO YES
Switcher Configuration SINGLE BOOST
Switching Frequency-Max 500 kHz 500 kHz
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 3
Rohs Code No
Input Voltage-Nom 15 V
JESD-609 Code e0
Length 4.93 mm
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 240
Seated Height-Max 1.879 mm
Technology BICMOS
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.94 mm

Compare SG1845J/883B with alternatives

Compare MIC38C42BM with alternatives