SG1825CJ
vs
UC1825BLP/883BC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
UNITRODE CORP
|
| Package Description |
DIP, DIP16,.3
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
|
| Additional Feature |
CAN ALSO BE CONFIGURED IN VOLTAGE MODE
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
30 V
|
20 V
|
| Input Voltage-Min |
10 V
|
11 V
|
| Input Voltage-Nom |
15 V
|
|
| JESD-30 Code |
R-CDIP-T16
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Length |
19.62 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Current-Max |
0.2 A
|
2.2 A
|
| Output Voltage-Nom |
5.1 V
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
| Switching Frequency-Max |
1500 kHz
|
1000 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
|
| Base Number Matches |
3
|
1
|
| Supply Current-Max (Isup) |
|
36 mA
|
|
|
|
Compare SG1825CJ with alternatives
Compare UC1825BLP/883BC with alternatives