SG1536Y-DESC
vs
MC1436DR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MOTOROLA INC
Part Package Code
DIP
SOIC
Package Description
DIP-8
SOP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.035 µA
0.055 µA
Common-mode Reject Ratio-Nom
110 dB
110 dB
Input Offset Voltage-Max
7000 µV
14000 µV
JESD-30 Code
R-CDIP-T8
R-PDSO-G8
JESD-609 Code
e0
Length
9.905 mm
4.9 mm
Neg Supply Voltage Limit-Max
-40 V
-34 V
Neg Supply Voltage-Nom (Vsup)
-28 V
-28 V
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
1.75 mm
Slew Rate-Nom
2 V/us
2 V/us
Supply Voltage Limit-Max
40 V
34 V
Supply Voltage-Nom (Vsup)
28 V
28 V
Surface Mount
NO
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
2
4
Pin Count
8
Common-mode Reject Ratio-Min
70 dB
Supply Current-Max
5 mA
Unity Gain BW-Nom
1000
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