SG1524J/883B vs UC2524J feature comparison

SG1524J/883B Microsemi Corporation

Buy Now Datasheet

UC2524J Rochester Electronics LLC

Buy Now Datasheet
Pbfree Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SILICON GENERAL INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description , CERAMIC, DIP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Analog IC - Other Type SWITCHING CONTROLLER SWITCHING CONTROLLER
Control Mode VOLTAGE-MODE VOLTAGE-MODE
Control Technique PULSE WIDTH MODULATION PULSE WIDTH MODULATION
Input Voltage-Max 40 V 40 V
Input Voltage-Min 8 V 8 V
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -25 °C
Output Current-Max 0.1 A 0.1 A
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified
Supply Current-Max (Isup) 10 mA
Surface Mount NO NO
Switcher Configuration PUSH-PULL PUSH-PULL
Switching Frequency-Max 300 kHz 300 kHz
Temperature Grade MILITARY OTHER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code No
Input Voltage-Nom 20 V
JESD-609 Code e0
Moisture Sensitivity Level NOT SPECIFIED
Output Voltage-Nom 5 V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Technology BIPOLAR
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare SG1524J/883B with alternatives

Compare UC2524J with alternatives