SFF75N10MUB
vs
IRFN140-JQR-B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
SOLID STATE DEVICES INC
TT ELECTRONICS PLC
Part Package Code
TO-254AA
Package Description
FLANGE MOUNT, S-XSFM-P3
CHIP CARRIER, R-XBCC-N3
Pin Count
3
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Avalanche Energy Rating (Eas)
2500 mJ
250 mJ
Configuration
SINGLE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
100 V
100 V
Drain Current-Max (ID)
56 A
28 A
Drain-source On Resistance-Max
0.02 Ω
0.125 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code
TO-254AA
TO-276AB
JESD-30 Code
S-XSFM-P3
R-XBCC-N3
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
SQUARE
RECTANGULAR
Package Style
FLANGE MOUNT
CHIP CARRIER
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Terminal Form
PIN/PEG
NO LEAD
Terminal Position
SINGLE
BOTTOM
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
2
Rohs Code
Case Connection
DRAIN
Operating Temperature-Max
150 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Pulsed Drain Current-Max (IDM)
112 A
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare SFF75N10MUB with alternatives
Compare IRFN140-JQR-B with alternatives