SF26-B
vs
EGP20G-BP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| JESD-609 Code |
e0
|
e3
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DO-15
|
| Package Description |
|
PLASTIC PACKAGE-2
|
| Pin Count |
|
2
|
| HTS Code |
|
8541.10.00.80
|
| Additional Feature |
|
LOW LEAKAGE CURRENT
|
| Application |
|
EFFICIENCY
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
|
DO-15
|
| JESD-30 Code |
|
O-PALF-W2
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
75 A
|
| Number of Elements |
|
1
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
2
|
| Output Current-Max |
|
2 A
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Qualification Status |
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
|
400 V
|
| Reverse Recovery Time-Max |
|
0.075 µs
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
|
|
|
Compare SF26-B with alternatives
Compare EGP20G-BP with alternatives