SF21
vs
BYW100-50
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Reach Compliance Code |
compliant
|
compliant
|
| Application |
ULTRA FAST RECOVERY
|
EFFICIENCY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.95 V
|
1.2 V
|
| JEDEC-95 Code |
DO-15
|
|
| JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
|
| Non-rep Pk Forward Current-Max |
50 A
|
50 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
2 A
|
1.5 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
50 V
|
50 V
|
| Reverse Recovery Time-Max |
0.035 µs
|
0.035 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Additional Feature |
|
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
| Operating Temperature-Min |
|
-40 °C
|
| Power Dissipation-Max |
|
1.3 W
|
| Reverse Current-Max |
|
10 µA
|
|
|
|
Compare SF21 with alternatives
Compare BYW100-50 with alternatives