SF18G-AP
vs
UF1J
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
CONTINENTAL DEVICE INDIA LTD
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
|
| Samacsys Manufacturer |
MCC
|
|
| Application |
GENERAL PURPOSE
|
EFFICIENCY
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.7 V
|
1.7 V
|
| JEDEC-95 Code |
DO-41
|
DO-214AA
|
| JESD-30 Code |
O-PALF-W2
|
R-PDSO-C2
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
30 A
|
30 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-50 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Reverse Current-Max |
5 µA
|
10 µA
|
| Reverse Recovery Time-Max |
0.035 µs
|
0.1 µs
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
WIRE
|
C BEND
|
| Terminal Position |
AXIAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Base Number Matches |
1
|
15
|
| Package Description |
|
SMB, 2 PIN
|
| Breakdown Voltage-Min |
|
600 V
|
| Reference Standard |
|
TS-16949
|
| Reverse Test Voltage |
|
600 V
|
|
|
|
Compare SF18G-AP with alternatives