SF10W1022BALQ vs RP73C2E10K2BTDG feature comparison

SF10W1022BALQ Walsin Technology Corporation

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RP73C2E10K2BTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WALSIN TECHNOLOGY CORP TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8533.21.00.30
Additional Feature ANTI-SULFUR, HIGH PRECISION, LASER TRIMMABLE HIGH PRECISION
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.1 mm 3.1 mm
Package Style SMT SMT
Package Width 2.6 mm 2.4 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.3 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200 MIL-STD-202
Resistance 10200 Ω 10200 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1210 1210
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 10 ppm/°C 10 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Series RP73

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Compare RP73C2E10K2BTDG with alternatives