SF06Z4750BALQ vs RN73A1J475RBTDG feature comparison

SF06Z4750BALQ Walsin Technology Corporation

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RN73A1J475RBTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WALSIN TECHNOLOGY CORP TE CONNECTIVITY LTD
Package Description CHIP CHIP, ROHS COMPLIANT
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature ANTI-SULFUR, HIGH PRECISION, LASER TRIMMABLE HIGH PRECISION
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.55 mm 1.55 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, Paper, 7 Inch TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.1 W 0.063 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200
Resistance 475 Ω 475 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 5 ppm/°C 5 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e3
Package Shape RECTANGULAR PACKAGE

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