SF06R3303DTLQ vs RP73F1J330KDTDG feature comparison

SF06R3303DTLQ Walsin Technology Corporation

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RP73F1J330KDTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WALSIN TECHNOLOGY CORP TE CONNECTIVITY LTD
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature ANTI-SULFUR, HIGH PRECISION, LASER TRIMMABLE HIGH PRECISION
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.55 mm 1.55 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200 MIL-STD-202
Resistance 330000 Ω 330000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 75 V 75 V
Base Number Matches 1 1
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Series RP73

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Compare RP73F1J330KDTDG with alternatives