SED1330FBB
vs
SED1330FBB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRO ELECTRONICS LTD
INTEGRATED SILICON SOLUTION INC
Part Package Code
QFP
Package Description
QFP,
QFP,
Pin Count
60
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
1
Bus Compatibility
68 SERIES; 80 SERIES
6800; 8080
Clock Frequency-Max
10 MHz
10 MHz
External Data Bus Width
8
8
JESD-30 Code
S-PQFP-G60
S-PQFP-G60
Number of Terminals
60
60
Operating Temperature-Max
75 °C
75 °C
Operating Temperature-Min
-20 °C
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
2.7 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL EXTENDED
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
DISPLAY CONTROLLER, DOT MATRIX LCD DISPLAY
DISPLAY CONTROLLER, DOT MATRIX LCD DISPLAY
Base Number Matches
1
1
Rohs Code
Display Configuration
640 X 256 PIXELS
Length
14 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Pitch
1 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm