SE556F vs TLC556INE4 feature comparison

SE556F AMD

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TLC556INE4 Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE PULSE; RECTANGULAR
JESD-30 Code R-CDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 7 1
Pbfree Code Yes
Samacsys Manufacturer Texas Instruments
Additional Feature IT CAN ALSO OPERATE AT 5V OR 15V NOMINALS
Length 19.305 mm
Output Frequency-Max 1.2 MHz
Seated Height-Max 5.08 mm
Width 7.62 mm

Compare SE556F with alternatives

Compare TLC556INE4 with alternatives