SE556CN vs NE556NE4 feature comparison

SE556CN NXP Semiconductors

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NE556NE4 Texas Instruments

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Part Life Cycle Code Obsolete Lifetime Buy
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
Samacsys Manufacturer Texas Instruments
Additional Feature CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY
Analog IC - Other Type PULSE; RECTANGULAR
Length 19.305 mm
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Supply Current-Max (Isup) 24 mA
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare SE556CN with alternatives

Compare NE556NE4 with alternatives