SE555CN-14
vs
LM555J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SIGNETICS CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP14,.3
CERAMIC, DIP-8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
JESD-30 Code
R-PDIP-T14
R-GDIP-T8
JESD-609 Code
e0
e0
Number of Terminals
14
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Analog IC - Other Type
PULSE; RECTANGULAR
Number of Functions
1
Seated Height-Max
5.08 mm
Supply Current-Max (Isup)
12 mA
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
15 V
Width
7.62 mm
Compare SE555CN-14 with alternatives
Compare LM555J with alternatives