SE555CDR vs SE555JG feature comparison

SE555CDR Texas Instruments

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SE555JG Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 Code R-PDSO-G8 R-GDIP-T8
Length 4.9 mm 9.58 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 16 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code No
Samacsys Manufacturer Texas Instruments
Additional Feature CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY
JESD-609 Code e0
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Current-Max (Isup) 12 mA
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SE555CDR with alternatives

Compare SE555JG with alternatives