SE555CDR vs SE555CN-14 feature comparison

SE555CDR Texas Instruments

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SE555CN-14 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC SIGNETICS CORP
Part Package Code SOIC
Package Description SOP, DIP, DIP14,.3
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR
JESD-30 Code R-PDSO-G8 R-PDIP-T14
Length 4.9 mm
Number of Functions 1
Number of Terminals 8 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP14,.3
Technology BIPOLAR
Terminal Finish Tin/Lead (Sn/Pb)

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