SE5534AJG
vs
SA5534AN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP, DIP8,.3
PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
1.5 µA
2 µA
Common-mode Reject Ratio-Min
80 dB
Common-mode Reject Ratio-Nom
100 dB
100 dB
Frequency Compensation
YES (AVCL>=3)
YES (AVCL>=3)
Input Offset Voltage-Max
3000 µV
5000 µV
JESD-30 Code
R-GDIP-T8
R-PDIP-T8
Length
9.6 mm
9.5 mm
Low-Offset
NO
NO
Neg Supply Voltage Limit-Max
-22 V
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.2 mm
Slew Rate-Nom
13 V/us
13 V/us
Supply Current-Max
9 mA
10 mA
Supply Voltage Limit-Max
22 V
22 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Unity Gain BW-Nom
10000
10000
Voltage Gain-Min
25000
15000
Width
7.62 mm
7.62 mm
Base Number Matches
2
4
Bias Current-Max (IIB) @25C
1.5 µA
Moisture Sensitivity Level
1
Compare SE5534AJG with alternatives
Compare SA5534AN with alternatives