SE370C702JNT
vs
SE370C702FZT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
DIP,
QCCJ, LDCC28,.5SQ
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
NO
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
Clock Frequency-Max
5 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-CDIP-T64
S-CQCC-J28
Number of I/O Lines
13
22
Number of Terminals
64
28
On Chip Program ROM Width
8
8
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCJ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
ROM (words)
8192
8192
ROM Programmability
UVPROM
UVPROM
Speed
5 MHz
5 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
J BEND
Terminal Position
DUAL
QUAD
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Pbfree Code
Rohs Code
CPU Family
TMS370
Length
11.24 mm
Package Equivalence Code
LDCC28,.5SQ
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (bytes)
256
Seated Height-Max
4.57 mm
Supply Current-Max
36 mA
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
11.24 mm
Compare SE370C702JNT with alternatives
Compare SE370C702FZT with alternatives