SE370C702FZT
vs
SE370C702JNL
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
DIP,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
TMS370
|
|
| Clock Frequency-Max |
20 MHz
|
5 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-CQCC-J28
|
R-CDIP-T64
|
| Length |
11.24 mm
|
|
| Number of I/O Lines |
22
|
13
|
| Number of Terminals |
28
|
64
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
NO
|
YES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
|
| ROM (words) |
8192
|
8192
|
| ROM Programmability |
UVPROM
|
UVPROM
|
| Seated Height-Max |
4.57 mm
|
|
| Speed |
5 MHz
|
5 MHz
|
| Supply Current-Max |
36 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
11.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Boundary Scan |
|
NO
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
|
|
|
Compare SE370C702FZT with alternatives
Compare SE370C702JNL with alternatives