SDR6304S
vs
JAN1N6304
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DO-5
|
|
| Package Description |
HERMETIC SEALED PACKAGE-1
|
DO-5, 1 PIN
|
| Pin Count |
1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Application |
EFFICIENCY
|
EFFICIENCY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-5
|
DO-203AB
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Non-rep Pk Forward Current-Max |
800 A
|
800 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Output Current-Max |
70 A
|
70 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Rep Pk Reverse Voltage-Max |
50 V
|
50 V
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.05 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Factory Lead Time |
|
35 Weeks
|
| Forward Voltage-Max (VF) |
|
0.975 V
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
MIL-19500/550B
|
| Reverse Current-Max |
|
25 µA
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare SDR6304S with alternatives
Compare JAN1N6304 with alternatives