SDR1BHF
vs
EC31QS06
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
NIHON INTER ELECTRONICS CORP
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
R-PDSO-C2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
GENERAL PURPOSE
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
3.3 V
|
0.61 V
|
| JESD-30 Code |
E-XALF-W2
|
R-PDSO-C2
|
| Non-rep Pk Forward Current-Max |
25 A
|
50 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
ELLIPTICAL
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
100 V
|
60 V
|
| Reverse Recovery Time-Max |
0.035 µs
|
|
| Surface Mount |
NO
|
YES
|
| Terminal Form |
WIRE
|
C BEND
|
| Terminal Position |
AXIAL
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
LOW POWER LOSS
|
| Operating Temperature-Min |
|
-40 °C
|
| Technology |
|
SCHOTTKY
|
|
|
|
Compare SDR1BHF with alternatives
Compare EC31QS06 with alternatives