SDINBDG4-8G-I1
vs
SDINBDG4-8G-IQ
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
WESTERN DIGITAL CORP
|
WESTERN DIGITAL CORP
|
Package Description |
TFBGA-153
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Factory Lead Time |
26 Weeks
|
|
Clock Frequency-Max (fCLK) |
200 MHz
|
200 MHz
|
Data Retention Time-Min |
1
|
1
|
Endurance |
3000 Write/Erase Cycles
|
3000 Write/Erase Cycles
|
JESD-30 Code |
R-PBGA-B153
|
R-PBGA-B153
|
Length |
13 mm
|
13 mm
|
Memory Density |
68719476736 bit
|
68719476736 bit
|
Memory IC Type |
FLASH CARD
|
FLASH CARD
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
153
|
153
|
Number of Words |
8589934592 words
|
8589934592 words
|
Number of Words Code |
8000000000
|
8000000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Organization |
8GX8
|
8GX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA153,14X14,20
|
BGA153,14X14,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
3.3 V
|
3.3 V
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Type |
MLC NAND TYPE
|
MLC NAND TYPE
|
Width |
11.5 mm
|
11.5 mm
|
Base Number Matches |
3
|
1
|
|
|
|
Compare SDINBDG4-8G-I1 with alternatives
Compare SDINBDG4-8G-IQ with alternatives