SDA5000HF vs R5000FGP-BP feature comparison

SDA5000HF Solid State Devices Inc (SSDI)

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R5000FGP-BP Micro Commercial Components

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Part Life Cycle Code Active Active
Ihs Manufacturer SOLID STATE DEVICES INC MICRO COMMERCIAL COMPONENTS CORP
Package Description R-XDSS-W2 O-PALF-W2
Pin Count 2
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Application GENERAL PURPOSE GENERAL PURPOSE
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code R-XDSS-W2 O-PALF-W2
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Output Current-Max 0.5 A 0.5 A
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR ROUND
Package Style SPECIAL SHAPE LONG FORM
Rep Pk Reverse Voltage-Max 5000 V 5000 V
Reverse Recovery Time-Max 0.03 µs 0.3 µs
Surface Mount NO NO
Terminal Form WIRE WIRE
Terminal Position DUAL AXIAL
Base Number Matches 1 1
Rohs Code Yes
Date Of Intro 2018-05-09
Additional Feature HIGH RELIABILITY
JEDEC-95 Code DO-15
JESD-609 Code e3
Moisture Sensitivity Level 1
Non-rep Pk Forward Current-Max 20 A
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 260
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 5

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