SDA5000
vs
SAM50FSMSTX
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
SOLID STATE DEVICES INC
|
| Package Description |
HVSTICK-2
|
E-LELF-R2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
7 V
|
|
| JESD-30 Code |
R-XALF-W2
|
E-LELF-R2
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Output Current-Max |
0.5 A
|
0.5 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ELLIPTICAL
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
5000 V
|
5000 V
|
| Reverse Recovery Time-Max |
5 µs
|
0.15 µs
|
| Surface Mount |
NO
|
YES
|
| Terminal Form |
WIRE
|
WRAP AROUND
|
| Terminal Position |
AXIAL
|
END
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Non-rep Pk Forward Current-Max |
|
25 A
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
MIL-19500
|
|
|
|
Compare SDA5000 with alternatives
Compare SAM50FSMSTX with alternatives