SCN2681AC1N28 vs SCC68692E1A44,518 feature comparison

SCN2681AC1N28 YAGEO Corporation

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SCC68692E1A44,518 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description , QCCJ,
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 4 4
Boundary Scan NO NO
Clock Frequency-Max 4 MHz 4 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T28 S-PQCC-J44
Low Power Mode NO YES
Number of Serial I/Os 2 2
Number of Terminals 28 44
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCJ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology NMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE J BEND
Terminal Position DUAL QUAD
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Rohs Code Yes
Part Package Code LCC
Pin Count 44
Manufacturer Package Code SOT187-2
Samacsys Manufacturer NXP
Bus Compatibility S68000
JESD-609 Code e3
Length 16.5862 mm
Moisture Sensitivity Level 3
Number of DMA Channels
Number of I/O Lines 14
On Chip Data RAM Width
Peak Reflow Temperature (Cel) 245
RAM (words) 0
Seated Height-Max 4.57 mm
Supply Current-Max 10 mA
Terminal Finish Tin (Sn)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 16.5862 mm

Compare SCN2681AC1N28 with alternatives

Compare SCC68692E1A44,518 with alternatives