SCN2681AC1F28
vs
MC68681FN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
LCC
|
| Package Description |
DIP,
|
QCCJ,
|
| Pin Count |
28
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
4
|
4
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
3.68 MHz
|
4 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-GDIP-T28
|
S-PQCC-J44
|
| Low Power Mode |
NO
|
NO
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
3
|
14
|
| Number of Serial I/Os |
2
|
2
|
| Number of Terminals |
28
|
44
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Seated Height-Max |
5.84 mm
|
4.57 mm
|
| Supply Current-Max |
150 mA
|
150 mA
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
NMOS
|
MOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
16.5862 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| Bus Compatibility |
|
68000
|
| JESD-609 Code |
|
e0
|
| Length |
|
16.5862 mm
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare SCN2681AC1F28 with alternatives
Compare MC68681FN with alternatives