SCL4555BC+
vs
CD4555BD3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
R & E INTERNATIONAL INC
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
,
DIP-16
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-GDIP-T16
R-CDIP-T16
Logic IC Type
2-LINE TO 4-LINE DECODER
2-LINE TO 4-LINE DECODER
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
280 ns
440 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Rohs Code
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.00035999999999999997 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
440 ns
Screening Level
38535Q/M;38534H;883B
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare SCL4555BC+ with alternatives
Compare CD4555BD3 with alternatives