SCL4085BD
vs
HEF4085BDF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
R & E INTERNATIONAL INC
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-GDIP-T14
|
R-GDIP-T14
|
| Logic IC Type |
AND-OR-INVERT GATE
|
AND-OR-INVERT GATE
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
2
|
4
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
450 ns
|
155 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Additional Feature |
|
EXPANDABLE
|
| Load Capacitance (CL) |
|
50 pF
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Seated Height-Max |
|
5.08 mm
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare SCL4085BD with alternatives
Compare HEF4085BDF with alternatives