SCE33S512160AE-75BI
vs
IM5116SDBBBG-6H
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Contact Manufacturer
Ihs Manufacturer
XIAN UNILC SEMICONDUCTORS CO LTD
I'M INTELLIGENT MEMORY LTD
Package Description
TSOP2,
TFBGA,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5.4 ns
5.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PDSO-G54
S-PBGA-B54
Length
22.22 mm
8 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
54
54
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32MX16
32MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TFBGA
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
8 mm
Base Number Matches
1
2
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare SCE33S512160AE-75BI with alternatives
Compare IM5116SDBBBG-6H with alternatives