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SCC68692E1N40,602 vs XR-68C681N feature comparison

SCC68692E1N40,602 NXP Semiconductors

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XR-68C681N Exar Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS EXAR CORP
Part Package Code DIP DIP
Package Description DIP, DIP40,.6 0.600 INCH, CERAMIC, DIP-40
Pin Count 40 40
Manufacturer Package Code SOT129-1
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01
Address Bus Width 4 4
Boundary Scan NO NO
Bus Compatibility S68000 MC68681; SCC68692
Clock Frequency-Max 4 MHz 4 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-GDIP-T40
JESD-609 Code e3 e0
Length 52 mm 51.82 mm
Low Power Mode YES NO
Number of DMA Channels
Number of I/O Lines 14 14
Number of Serial I/Os 2 2
Number of Terminals 40 40
On Chip Data RAM Width
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 4.7 mm 5.72 mm
Supply Current-Max 10 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 2
Microcontrollers and Processors » Serial IO/Communication Controllers
Microcontrollers and Processors » Serial IO/Communication Controllers

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