SCC68692E1F40
vs
SCC2692AE1F40
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
PHILIPS COMPONENTS
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
,
|
DIP, DIP40,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
4
|
|
| Boundary Scan |
NO
|
|
| Bus Compatibility |
S68000
|
|
| Clock Frequency-Max |
4 MHz
|
|
| Communication Protocol |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP
|
|
| Data Encoding/Decoding Method |
NRZ
|
|
| Data Transfer Rate-Max |
0.125 MBps
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
R-CDIP-T40
|
R-XDIP-T40
|
| Low Power Mode |
NO
|
|
| Number of Serial I/Os |
2
|
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP40,.6
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare SCC68692E1F40 with alternatives