SCC2692AC1N28,602
vs
SCN2681AC1F28
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP28,.6
|
DIP,
|
| Pin Count |
28
|
28
|
| Manufacturer Package Code |
SOT117-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
4
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
3.6864 MHz
|
|
| Communication Protocol |
ASYNC, BIT
|
|
| Data Encoding/Decoding Method |
NRZ
|
|
| Data Transfer Rate-Max |
0.125 MBps
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
R-PDIP-T28
|
|
| JESD-609 Code |
e3
|
|
| Length |
35.5 mm
|
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
3
|
|
| Number of Serial I/Os |
2
|
|
| Number of Terminals |
28
|
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (words) |
0
|
|
| Seated Height-Max |
5.1 mm
|
|
| Supply Current-Max |
10 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
|
| Base Number Matches |
1
|
3
|
|
|
|
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SCC2692AC1N28,602 vs SCC2692AE1N28,129
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SCC2692AC1N28,602 vs SCN2681AE1N28
Compare SCN2681AC1F28 with alternatives