SCC2692AC1F28
vs
933981720602
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
DIP, DIP28,.6
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
R-CDIP-T28
R-PDIP-T40
JESD-609 Code
e0
e3
Number of Terminals
28
40
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
3
1
Pbfree Code
Part Package Code
DIP
Pin Count
40
Address Bus Width
4
Boundary Scan
NO
Clock Frequency-Max
4 MHz
Communication Protocol
ASYNC, BIT
Data Transfer Rate-Max
0.125 MBps
External Data Bus Width
8
Length
52 mm
Low Power Mode
YES
Number of Serial I/Os
2
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
4.7 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Compare 933981720602 with alternatives