SCC2691AC1A28 vs SCC2691AC1A28,512 feature comparison

SCC2691AC1A28 NXP Semiconductors

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SCC2691AC1A28,512 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC LCC
Package Description PLASTIC, MS-018, SOT-261-2, LCC-28 PLASTIC, MS-018, SOT261-2, LCC-28
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 4 MHz 4 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.0046875 MBps 0.0046875 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J28 S-PQCC-J28
JESD-609 Code e3
Length 11.505 mm 11.505 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of DMA Channels
Number of I/O Lines 1
Number of Serial I/Os 1 1
Number of Terminals 28 28
On Chip Data RAM Width
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC28,.5SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
RAM (words) 0
Seated Height-Max 4.57 mm 4.57 mm
Supply Current-Max 2 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin (Sn)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 11.505 mm 11.505 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 10 1
Manufacturer Package Code SOT261-2

Compare SCC2691AC1A28 with alternatives

Compare SCC2691AC1A28,512 with alternatives