SCC2691AC1A28,602 vs SCC2691AE1A28,512 feature comparison

SCC2691AC1A28,602 NXP Semiconductors

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SCC2691AE1A28,512 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC LCC
Package Description QCCJ, LDCC28,.5SQ PLASTIC, MS-018, SOT261-2, LCC-28
Pin Count 28 28
Manufacturer Package Code SOT261-2 SOT261-2
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 4 MHz 4 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.0046875 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J28 S-PQCC-J28
JESD-609 Code e3
Length 11.505 mm 11.505 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1 3
Number of DMA Channels
Number of I/O Lines 1
Number of Serial I/Os 1 1
Number of Terminals 28 28
On Chip Data RAM Width
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC28,.5SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified
RAM (words) 0
Seated Height-Max 4.57 mm 4.57 mm
Supply Current-Max 2 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.505 mm 11.505 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Time@Peak Reflow Temperature-Max (s) 30

Compare SCC2691AC1A28,602 with alternatives

Compare SCC2691AE1A28,512 with alternatives