SCB33S512320AE-75BI
vs
IS45VM32160E-75BLI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
XIAN UNILC SEMICONDUCTORS CO LTD
INTEGRATED SILICON SOLUTION INC
Package Description
TSOP2,
TFBGA,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5.4 ns
6 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PDSO-G86
R-PBGA-B90
Length
22.22 mm
13 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
86
90
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX32
16MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
8 mm
Base Number Matches
1
1
Rohs Code
Compare SCB33S512320AE-75BI with alternatives
Compare IS45VM32160E-75BLI with alternatives