SCB18T2G160AF-25E
vs
MT47H128M16RT-25EAAT:C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
XIAN UNILC SEMICONDUCTORS CO LTD
MICRON TECHNOLOGY INC
Package Description
TFBGA,
TFBGA, BGA84,9X15,32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
0.4 ns
0.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B84
R-PBGA-B84
Length
12.5 mm
12.5 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
DDR DRAM
DDR2 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
84
84
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
95 °C
105 °C
Operating Temperature-Min
-40 °C
Organization
128MX16
128MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
9 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
84
Clock Frequency-Max (fCLK)
400 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
JESD-609 Code
e1
Output Characteristics
3-STATE
Package Equivalence Code
BGA84,9X15,32
Qualification Status
Not Qualified
Refresh Cycles
8192
Screening Level
AEC-Q100
Sequential Burst Length
4,8
Standby Current-Max
0.012 A
Supply Current-Max
0.33 mA
Terminal Finish
TIN SILVER COPPER
Compare SCB18T2G160AF-25E with alternatives
Compare MT47H128M16RT-25EAAT:C with alternatives