SCANSTA112SMX/NOPB
vs
SCANSTA112SM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
BGA-100
FBGA-100
Pin Count
100
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
External Data Bus Width
JESD-30 Code
S-PBGA-B100
S-PBGA-B100
JESD-609 Code
e1
e0
Length
10 mm
10 mm
Moisture Sensitivity Level
4
3
Number of Terminals
100
100
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA100,10X10,32
BGA100,10X10,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.5 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
MICROPROCESSOR CIRCUIT
Base Number Matches
1
4